3D-Heterogeneously Integrated Photonic (HIP) Imaging Sensor
AI Overview
This RFP seeks development of 3D heterogeneously integrated photonic imaging sensors that stack detector, readout electronics, and optical interconnect layers to overcome copper bandwidth limitations in advanced military EO/IR focal plane arrays. The solution enables concurrent wide field-of-view, high resolution, and ultra-high frame rate imaging through innovative vertical integration and cryogenic-compatible design.
This summary is AI-generated from the official solicitation.
Key Details
Official Description
Emerging military electro-optical and infrared (EO/IR) sensors enable high resolution through small pixels, wide field-of-view through large arrays, and high frame rate through high sensitivity and low latency. For the most advanced focal plane array (FPA) sensors, the data bandwidth dictated by the high pixel count and bit rate is reaching the limits of conventional copper wire interconnects. Datalinks using optical interconnects offer a unique and commercially mature solution that can obviate ...
Change History
3D-Heterogeneously Integrated Photonic (HIP) Imaging Sensor
Close Date changed from 2026-04-22 to 2026-06-03
3D-Heterogeneously Integrated Photonic (HIP) Imaging Sensor
Open Date changed from 2026-03-25 to 2026-05-06
3D-Heterogeneously Integrated Photonic (HIP) Imaging Sensor
Status changed from Removed to Pre-Release
3D-Heterogeneously Integrated Photonic (HIP) Imaging Sensor
Opportunity DON26BZ01-NV024 no longer available
3D-Heterogeneously Integrated Photonic (HIP) Imaging Sensor
New opportunity: 3D-Heterogeneously Integrated Photonic (HIP) Imaging Sensor
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