DON26TZ01-NV013Pre-ReleaseSBIR

Flexible Printed Thermoelectric Cooling Film

Department of DefenseNAVY

AI Overview

This RFP seeks development of lightweight, flexible thermoelectric cooling films using organic materials for personal and large-area applications. The solution must achieve sub-one-inch bending radius and conformal contact to curved surfaces while prioritizing flexibility and cost over efficiency for niche cooling needs.

This summary is AI-generated from the official solicitation.

Key Details

Agency
Department of Defense
Funding Amount
Release Date
March 2, 2026
Due Date
June 3, 2026

Official Description

Thermoelectric cooling devices based on narrow bandgap semiconductors such as bismuth telluride are commercially available. They are solid state devices and thus do not have the large footprint and moving parts associated with vapor compression refrigeration systems; however, they operate with lower efficiency. They are well-suited for cooling small flat surfaces where one is more concerned with the form factor than efficiency. For many practical applications, these square ceramic tile thermoele...

Change History

Date ChangedApr 14, 2026 at 3:04 AM

Flexible Printed Thermoelectric Cooling Film

Close Date changed from 2026-04-22 to 2026-06-03

Date ChangedApr 14, 2026 at 3:04 AM

Flexible Printed Thermoelectric Cooling Film

Open Date changed from 2026-03-25 to 2026-05-06

Status ChangedApr 14, 2026 at 3:04 AM

Flexible Printed Thermoelectric Cooling Film

Status changed from Removed to Pre-Release

Opportunity RemovedMar 3, 2026 at 4:25 PM

Flexible Printed Thermoelectric Cooling Film

Opportunity DON26TZ01-NV013 no longer available

Opportunity AddedMar 2, 2026 at 11:14 PM

Flexible Printed Thermoelectric Cooling Film

New opportunity: Flexible Printed Thermoelectric Cooling Film

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