Scalable Hard-mask materials with Improved Etch resistance and Low Degradation for Extreme-aspect-Ratio fabrication (SHIELDER)

Next-generation defense-relevant microsystem technologies, such as 3D integrated circuits, high-density memory arrays, MEMS inertial sensors and RF filters, and integrated photonic devices, rely on the precise manufacturing of extreme high-aspect-ratio features within a chip [1-3]. Furthermore, emerging architectures for multiferroic memory and logic components, such as those being pioneered under DARPA's Fast and Curious program [4], stand to benefit immensely from novel process flows capable o...